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This full-size 830-point solderless breadboard provides 63 rows of tie points with four bus lines spanning the full length of the board. It accommodates up t...

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This full-size 830-point solderless breadboard provides 63 rows of tie points with four bus lines spanning the full length of the board. It accommodates up to nine 14-pin DIP ICs or seven 16-pin DIP ICs, and labelled rows and columns make wiring easy to follow.

Multiple breadboards can be connected side-by-side for larger projects.

Key Features

  • 830 Tie Points – Full-size breadboard for medium to large circuits
  • 4 Bus Lines – Power rails spanning the full length of the board
  • Labelled Rows & Columns – Easy reference for wiring
  • Connectable – Link multiple boards together for larger projects

Specifications

  • Dimensions: 6.5" × 2.125" (165 × 54 mm)
  • Tie Points: 830
  • Rows: 63
  • Bus Lines: 4

Package Contents

  • 1× 830-Point Solderless Breadboard

Jargon buster

Plain-language definitions for the technical terms used above.

solderless breadboard
A reusable board with connected holes for building temporary circuits without soldering. It matters in beginner kits because students can change wiring quickly and safely while learning how components connect.

Related Tutorials

Free guides on learn.littlebird.com.au

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