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A compact aluminium heat sink from Cool Innovations, designed for surface-mount components such as SoCs, motor drivers, and other SMT packages. Trusted by en...

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A compact aluminium heat sink from Cool Innovations, designed for surface-mount components such as SoCs, motor drivers, and other SMT packages. Trusted by engineers for its low cost, ease of use, and excellent thermal performance in a tiny footprint.

The heat sink features four round fins for increased surface area and can be attached using thermal tape or a small amount of thermal paste (not included). The fins can be filed down if a shorter profile is needed to fit inside an enclosure.

Key Features

  • Compact SMT Design – Fits small surface-mount packages including BGAs, TSSOPs, and QFNs
  • Four Round Fins – Maximise heat dissipation in a minimal footprint
  • Low Thermal Resistance – Approximately 70°C/W in still air
  • Trimmable Height – Fins can be filed down to fit tighter enclosures

Specifications

  • Base Dimensions – 6.7 × 6.7mm (0.27" × 0.27")
  • Total Height – 7.6mm (0.3")
  • Material – Aluminium
  • Thermal Resistance – Approximately 70°C/W (still air)
  • Manufacturer – Cool Innovations

Ideal For

  • Surface-mount SoCs and processors
  • Motor drivers and voltage regulators
  • BGAs, TSSOPs, and QFN packages
  • Compact embedded projects with thermal management needs
Note: Thermal tape or thermal paste is not included. You will need to supply your own adhesive thermal interface material.

Package Contents

  • 1× Aluminium SMT Heat Sink

Related Tutorials

Free guides on learn.littlebird.com.au

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