Breadboard - Full-Size (Bare)
We have ✅ 14 available of the SF-PRT-12615 in our Sydney warehouse. An extra 610 units available with a short lead time.
A standard full-size solderless breadboard with 830 tie points for prototyping electronic circuits. The two sets of five columns are separated by a 0.3″ channel — perfectly sized for straddling DIP IC packages. Split power buses on each side make it easy to distribute power across your circuit.
Key Features
- 830 Tie Points – 10 columns × 63 rows plus 2 split power buses
- Standard 0.1″ Spacing – Compatible with all standard through-hole components
- Interlocking Edges – Connect multiple boards together for larger projects
- Self-Adhesive Backing – Stick the board to enclosures or mounting surfaces
- Wire Size: Accepts 20–29 AWG
Specifications
- Dimensions: 165.1 × 54.3 × 9.7 mm (6.5 × 2.1 × 0.38″)
- Tie Points: 830
- Pin Spacing: 2.54 mm (0.1″)
- DIP Channel: 7.62 mm (0.3″)
The Breadboard - Full-Size (Bare) appears in the following collections:
SKU SF-PRT-12615
by SparkFun
