SMT Test Socket - SOIC-20 Medium Breakout
A zero-insertion-force (ZIF) test socket for SMT components in SOIC/SOP medium-body packages. It accepts any SOIC chip with a 200 mil (5.08 mm) wide body and up to 20 pins, making it easy to program, test, and prototype with surface-mount ICs without soldering.
Press down on the lever, place the chip in the socket, and release — the IC is held securely against gold-plated contact fingers. The socket is mounted on a pair of breakout PCBs that convert it to a standard 20-pin DIP footprint with 0.6" (15.24 mm) row spacing, suitable for breadboard use.
Key Features
- ZIF Socket – Zero-insertion-force lever for easy chip placement and removal
- Gold Contact Fingers – Reliable, low-resistance connection to IC pins
- DIP Breakout – Converts SOIC to 20-pin DIP with 0.6" row spacing
- Breadboard Compatible – Plug directly into a standard breadboard
- High-Quality Construction – Japanese-made socket for durability and precision
Specifications
- Compatible Packages – SOIC/SOP medium body (200 mil / 5.08 mm wide)
- Max Pins – 20
- Output Footprint – 20-pin DIP, 0.6" (15.24 mm) row spacing
- Contact Material – Gold-plated
Note: This socket fits 200 mil (medium) body SOIC chips only. Narrow-body (150 mil) and wide-body (300 mil) SOIC packages require different sockets.
Ideal For
- Programming and testing SMT ICs without soldering
- Prototyping SOIC-based circuits on breadboards
- IC evaluation and comparison
The SMT Test Socket - SOIC-20 Medium Breakout appears in the following collections:
SKU AF-1282
by Little Bird
