SparkFun
Breadboard - Full-Size (Bare)
A standard full-size solderless breadboard with 830 tie points for prototyping electronic circuits. The two sets of five columns are separated by a 0.3″ chan...
A standard full-size solderless breadboard with 830 tie points for prototyping electronic circuits. The two sets of five columns are separated by a 0.3″ channel — perfectly sized for straddling DIP IC packages. Split power buses on each side make it easy to distribute power across your circuit.
Key Features
- 830 Tie Points – 10 columns × 63 rows plus 2 split power buses
- Standard 0.1″ Spacing – Compatible with all standard through-hole components
- Interlocking Edges – Connect multiple boards together for larger projects
- Self-Adhesive Backing – Stick the board to enclosures or mounting surfaces
- Wire Size: Accepts 20–29 AWG
Specifications
- Dimensions: 165.1 × 54.3 × 9.7 mm (6.5 × 2.1 × 0.38″)
- Tie Points: 830
- Pin Spacing: 2.54 mm (0.1″)
- DIP Channel: 7.62 mm (0.3″)
Jargon buster
Plain-language definitions for the technical terms used above.
- AWG
- American Wire Gauge is a numbering system for wire thickness, where a lower number means a thicker wire. The AWG rating matters because thicker wire can usually carry more current with less voltage drop and heating.
- solderless breadboard
- A reusable board with connected holes for building temporary circuits without soldering. It matters in beginner kits because students can change wiring quickly and safely while learning how components connect.
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Brands
Prototyping & Wiring
Supplier page — sparkfun.com
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Related Tutorials
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