Breadboard - Full-Size (Bare)
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Patrick Driver
SparkFun
Breadboard - Full-Size (Bare)
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A standard full-size solderless breadboard with 830 tie points for prototyping electronic circuits. The two sets of five columns are separated by a 0.3″ chan...
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A standard full-size solderless breadboard with 830 tie points for prototyping electronic circuits. The two sets of five columns are separated by a 0.3″ channel — perfectly sized for straddling DIP IC packages. Split power buses on each side make it easy to distribute power across your circuit.
Key Features
- 830 Tie Points – 10 columns × 63 rows plus 2 split power buses
- Standard 0.1″ Spacing – Compatible with all standard through-hole components
- Interlocking Edges – Connect multiple boards together for larger projects
- Self-Adhesive Backing – Stick the board to enclosures or mounting surfaces
- Wire Size: Accepts 20–29 AWG
Specifications
- Dimensions: 165.1 × 54.3 × 9.7 mm (6.5 × 2.1 × 0.38″)
- Tie Points: 830
- Pin Spacing: 2.54 mm (0.1″)
- DIP Channel: 7.62 mm (0.3″)
Jargon buster
Plain-language definitions for the technical terms used above.
- AWG
- American Wire Gauge is a numbering system for wire thickness, where a lower number means a thicker wire. The AWG rating matters because thicker wire can usually carry more current with less voltage drop and heating.
- solderless breadboard
- A reusable board with rows of internally connected holes for building circuits by pushing in components and jumper wires, with no soldering required. It lets you prototype and rewire a circuit quickly and reversibly before committing to a permanent, soldered build.
- through-hole
- A mounting style where the component leads pass through holes in a circuit board and are soldered on the other side. Through-hole parts are often easier to handle and solder by hand, which is useful for classroom and hobby projects.
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