400 Tie Point Interlocking Solderless Breadboard

A compact 400 tie-point solderless breadboard with interlocking edges and self-adhesive backing. The half-size form factor (82 × 62mm) makes it ideal for small projects, and the removable power rails let you slim it down to just 35mm wide for fitting onto Arduino protoshields.

Multiple boards can be snapped together lengthwise or widthwise to create larger prototyping surfaces, or cut in half with a saw to create two tiny breadboards.

Key Features

• 400 Tie Points – 30 rows (A–J) plus 2 power rails on each side
• Interlocking Design – Snap multiple boards together for larger projects
• Removable Power Rails – Pull off to slim the board down to 35mm wide
• Self-Adhesive Backing – Stick directly onto surfaces or protoshields
• Labelled Grid – Horizontal 1–30, vertical A–J

Specifications

• Tie Points – 400
• Dimensions – 82 × 62mm (3.2″ × 2.4″)
• Pin Spacing – 2.54mm (0.1″)
• Power Rails – 2 (removable)

Ideal For

• Small electronics prototyping projects
• Arduino protoshield add-ons
• Modular breadboard setups
• Educational electronics and STEM learning

Package Contents

• 1× 400 Tie-Point Interlocking Solderless Breadboard