DFRobot
Fermion BMP585 Pressure & Temperature Sensor - I2C/SPI/I3C
· MPN: SEN0666
This compact Fermion breakout brings the Bosch BMP585 MEMS pressure and temperature sensor to a tiny board for projects where space, power use and reliable e...
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This compact Fermion breakout brings the Bosch BMP585 MEMS pressure and temperature sensor to a tiny board for projects where space, power use and reliable environmental sensing matter. It measures barometric pressure for altitude and vertical movement applications, with typical absolute pressure accuracy of ±0.3 hPa.
The sensing unit uses a gel-filled housing to help protect the element from water intrusion, high humidity and chemical corrosion while still allowing pressure changes to be measured. That makes it suitable for outdoor monitoring, industrial sites, marine-style environments, UAV altitude hold, indoor floor detection and sports altimeters.
Integration is flexible, with I2C, SPI and I3C support through a 2.54 mm pin header socket. Built-in FIFO buffering and a configurable IIR filter can smooth pressure changes caused by wind gusts or vibration before the data reaches your host microcontroller.
DFRobot provides open-source libraries for Arduino and Python to help speed up prototyping. The shipping list includes the Fermion BMP585 sensor module and a 10pin-2.54 black single row pin header.
Specifications:
- Operating Voltage: DC 3.3V
- Operating Current: 200μA
- Sleep Current: 2μA
- Communication Interface: I2C / I3C /SPI
- Interface Form: 2.54mm Pin Header Socket
- I2C Address: 0x47 (Default) / 0x46
- Pressure Measurement Range: 30 ~ 125 kPa
- Temperature Measurement Range: 0 ~ 65 °C
- Absolute Pressure Accuracy: ±0.3 hPa (Typ.)
- Relative Pressure Accuracy: ±0.06 hPa / 10 kPa (Typ.)
- Relative Altitude Accuracy: ±0.5 m / 10 kPa
- Temperature Drift Coefficient: ±0.5 Pa / K
- Pressure Data Resolution: 1 / 64
- Ultra-Low Noise: < 0.1 Pa (RMS, without low-pass filter enabled)
- PCB Dimensions: 19×16×3.55 mm
- Mounting Hole Spacing: 14 mm
- Mounting Hole Diameter: 2.0 mm
Jargon buster
Plain-language definitions for the technical terms used above.
- breakout
- A breakout board carries a small or fine-pitched component and brings its connections out to standard, breadboard- and header-friendly pins. Describing a part as a breakout means it can be wired into a project without soldering directly to the component's tiny contacts.
- DC
- DC means direct current, where electricity flows in one constant direction, as supplied by batteries, USB ports and many plug-pack power supplies. When a product specifies DC, it runs from a DC supply rather than mains AC, so you need to provide the correct voltage and polarity.
- FIFO
- FIFO stands for "first in, first out", a way of handling stored items so the oldest one is read out first, like a queue. In electronics a FIFO is usually a small buffer that temporarily holds data, such as sensor samples or serial bytes, so a processor can collect it in batches instead of reading continuously.
- I2C
- I2C is a two-wire communication bus used by many sensors and small modules. It matters because several I2C devices can share the same two wires, but each device needs a compatible address and your controller must support I2C.
- I2C address
- An I2C address is the number a device uses so a microcontroller can tell it apart from other devices on the same I2C bus. It matters because two devices with the same fixed address may conflict if used together.
- I3C
- I3C is a newer two-wire communication bus designed as a faster, more capable successor to I2C for sensors and small peripherals. It matters because I3C devices may offer better speed and features, but they need compatible hardware and software support.
- Matter
- A smart home connectivity standard designed to let devices work across different ecosystems. It matters if you want a project to integrate more easily with platforms such as Apple Home, Google Home, or other Matter-compatible systems.
- microcontroller
- A microcontroller is a small computer on a single chip that runs a stored program and controls connected inputs and outputs such as buttons, sensors, displays and communication interfaces. In a device built around one, it is the part that executes the code and coordinates the device's behaviour.
- PCB
- A printed circuit board (PCB) is a board, usually rigid, with etched copper tracks that connect electronic components together without loose wiring. Components are mounted on the board and signals route between them through the copper layout.
- RMS
- RMS is a way of describing the effective level of an AC signal, such as an audio output voltage. It helps compare audio output levels more meaningfully than a peak voltage number.
- SPI
- A fast serial communication bus often used for displays, memory cards, and sensors. It matters because SPI devices need specific pins for clock and data, plus a separate chip-select line for each device.
- UAV
- UAV stands for Unmanned Aerial Vehicle, an aircraft that flies without an onboard pilot, such as a drone or autonomous aircraft. Because airborne platforms have limited payload, factors like weight, power draw and any positioning features such as GNSS or RTK are often important considerations.
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