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SKU: SF-SEN-11446

A breakout board for the Analog Devices ADXL362, a 3-axis MEMS accelerometer that operates at ultra-low power consumption. It measures both dynamic acceleration (motion, shock) and static acceleration (tilt), and communicates over SPI. Built-in digital logic enables autonomous "wake-on-shake" ope...

SKU: AF-1894

A 6" × 6" (152 × 152 mm) sheet of DuPont Pyralux flexible PCB material — the same material used to make flexible circuits in smartphones and consumer electronics. One side is 1 oz (35 µm) copper, and the other is 25 µm polyimide for strength and flexibility. Treat it like standard copper-clad bo...

SKU: AF-5664

Need to use multiple I2C devices that share the same address? The PCA9546 4-Channel STEMMA QT / Qwiic I2C Multiplexer lets you connect up to four same-address I2C devices with completely solderless wiring. Five JST SH connectors (1 input + 4 outputs) make it plug-and-play with any STEMMA QT or Qw...

SKU: SF-SEN-15335

The SparkFun 9DoF IMU Breakout brings InvenSense's ICM-20948 9-axis motion tracking sensor to a Qwiic-enabled breakout board with an on-board logic level shifter and broken-out GPIO pins. The ICM-20948 is an extremely low-power sensor supporting both I2C and SPI communication, suited for wearable...

SKU: SF-SEN-17241

The SparkFun ADXL313 Breakout is a low power, high resolution (up to 13-bits) 3-axis accelerometer for measurement up to ±4g. This breakout measures the static acceleration of gravity in tilt-sensing applications, as well as dynamic acceleration resulting from motion or shock. Digital output data...

SKU: DF-FIT0584 · MPN: FIT0584

This flexible silicone-insulated wire pair is made for high-current power wiring in demanding electronics, robotics and motion-control projects. It uses fine tin-plated copper strands for good conductivity and oxidation resistance, with a twisted multi-strand structure that helps reduce signal in...

SKU: DF-KIT0206 · MPN: KIT0206

This compact carrier kit bridges a LattePanda Mu compute module with a discrete MXM graphics card, giving embedded projects a ready-to-deploy platform for local AI inference, 3D rendering and high-density visual output. It is designed for space-constrained builds such as display systems, kiosk co...