DFRobot
Aluminum Fanless Heatsink for LattePanda Mu Compute Module
· MPN: FIT0989
A fanless aluminium alloy heatsink designed specifically for the LattePanda Mu compute module. The heat dissipation fins rapidly absorb CPU heat through pass...
A fanless aluminium alloy heatsink designed specifically for the LattePanda Mu compute module. The heat dissipation fins rapidly absorb CPU heat through passive convection, keeping the module at stable operating temperatures without any moving parts or noise.
Includes high-quality phase-change thermal material pre-applied to the contact surface for optimal thermal conductivity. The wall-mountable design integrates cleanly with LattePanda Mu carrier boards.
Key Features
- Completely Fanless – Silent passive cooling with no moving parts
- Aluminium Alloy Heatsink – Excellent thermal conductivity with finned design
- Phase-Change Thermal Material – Pre-applied for optimal CPU contact and thermal transfer
- All-Metal Construction – Corrosion-resistant aluminium alloy for durability
- Wall-Mountable – Designed for flexible mounting in custom enclosures
- Spring-Screw Mounting – Three-point attachment for even pressure distribution
Specifications
- Compatible Board – LattePanda Mu
- Heat Dissipation – TDP 6W (35°C rise), TDP 10W (60°C rise)
- Dimensions – 70 × 45.5 × 33mm
- Material – Aluminium alloy
- Weight – 100g
Package Contents
- 1× LattePanda Mu Fanless Heatsink (with pre-applied phase-change material)
Jargon buster
Plain-language definitions for the technical terms used above.
- TDP
- TDP, or thermal design power, is a guide to how much heat a processor’s cooling system is expected to handle. Checking the TDP rating helps you decide whether a heatsink or case is suitable for the board and workload you plan to use.
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Supplier page — dfrobot.com
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